Description
1. Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation
2. Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow
3. The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance
4. 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily
5. 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode
6. Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat
7. Monitor temperature changes and realize reflow soldering temperature curve data monitoring
8. Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
9. Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
Specification:
| Package Weight |
| One Package Weight |
1.22kgs / 2.69lb |
| One Package Size |
20cm * 18cm * 8cm / 7.87inch * 7.09inch * 3.15inch |
| Carton Weight |
20.40kgs / 44.97lb |
| Carton Size |
42cm * 38cm * 34cm / 16.54inch * 14.96inch * 13.39inch |
| Loading Container |
20GP: 491 cartons * 16 pcs = 7856 pcs
40HQ: 1140 cartons * 16 pcs = 18240 pcs
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